Solder ball application
Approximate reference range for a reference configuration.
DAYAN Precision Soldering
Laser Solder Ball Jetting Machines for Precision Electronics
Laser solder ball jetting machines and automation configurations for localized soldering in camera modules, VCM assemblies, FPCs, sensors, connectors and microelectronic products.
Equipment configurations
Choose the equipment path around the part and production flow
Start with the connection, workpiece presentation, access path, joint sequence and handling requirement. The configuration follows the application—not a generic equipment category.
Laser Solder Ball Jetting Machine
Review laser solder ball jetting machine specifications, configuration options, process flow and the information needed for a quotation.
Explore configuration →Dual-Station System
A two-station concept for applications that benefit from separated operator, fixture, loading or processing tasks.
Explore configuration →Inline System
A laser solder ball jetting concept for integration into a defined inline manufacturing flow.
Explore configuration →Desktop / Laboratory System
A compact configuration for engineering evaluation, small-batch process development and fixture trials.
Explore configuration →Jetting Module
A solder-ball jetting module concept for an equipment builder or automation integrator evaluating a custom process cell.
Explore configuration →Custom Automation
A custom precision laser soldering automation approach built from process evaluation and system integration requirements.
Explore configuration →What the process does
Controlled solder delivery for localized electronic joints
Laser solder ball jetting combines individual solder-ball feed, laser melting at the nozzle, gas-assisted transfer, motion, workholding and recipe control. It is evaluated when a localized joint needs a defined solder input and the part can be presented with practical access to the target.
Fixture support, a reliable part datum and the programmed joint sequence are part of the same process decision. Where an image-based reference is useful, vision is evaluated with the fixture and motion path rather than as a separate feature.
How the process works →
Capability reference
Technical references for an initial equipment discussion
Use these values to frame the conversation, then select the final system around the actual joint, fixture and application requirements.
Point-processing frequency
A maximum dot rate; it is not complete part cycle time.
Vision positioning
Reference value stated for one reference system.
Laser configuration
Referenced options selected with the process review.
Specifications vary by machine configuration and application. Final selection follows application testing.
From feed to joint
A repeatable sequence begins with a defined part relationship
The same sequence is reviewed with the target component, fixture, access direction and inspection requirement before a system configuration is selected.
- 01
Solder Ball Feeding
A controlled feed presents solder balls to the process head.
- 02
Individual Ball Separation
One ball is isolated before the next soldering cycle.
- 03
Precision Positioning
Programmable motion and vision reference the intended joint location.
- 04
Laser Melting
Laser energy is directed to melt the ball at the nozzle.
- 05
Gas-Assisted Jetting
Gas pressure transfers the molten solder toward the soldering position.
- 06
Solder Joint Formation
The localized process forms the required joint on the workpiece.
- 07
Inspection / Next Cycle
The process sequence continues according to the programmed path.
Process video and sample context
See the head, fixture and repeated soldering sequence
The process footage shows the jetting head, fixture-supported positions and repeated processing relationship. The fine-pitch video includes a demonstration of 0.25 mm solder ball processing on a 0.4 mm pitch test pattern.
Process video
Laser solder ball jetting process
Process footage showing the head, workpiece support and repeated jetting sequence.
Selection factors
What to review before choosing a system
A useful quote starts with the information that affects the joint, fixture, process path and handling flow.
- 01
Joint and pad geometry
Identify the target connection, available approach direction, required solder volume and clearance around the joint.
- 02
Workpiece support and reference
Define fixture support, part datum and whether a vision reference should be evaluated for the component.
- 03
Joint count and sequence
Map the programmed path, motion between locations and any inspection step; dot rate alone is not complete cycle time.
- 04
Loading and changeover
Clarify manual loading, part variation, fixture change and the intended production flow.
- 05
Acceptance requirement
State the visible, electrical, mechanical or other checks that should guide sample evaluation and configuration selection.
Application paths
Explore the assembly questions that shape the process
Each application route starts with the target connection, access, support and inspection requirement.
Camera ModulesEvaluate localized laser solder ball jetting for camera-module and VCM connections, with attention to access, fixture design, solder volume, inspection and sample inputs.→VCMEngineering evaluation factors for laser soldering of VCM-related components.→FPCEvaluate FPC-to-PCB, terminal and connector soldering with the right support, access, process route and automation path.→SensorsA process-evaluation approach to sensor soldering with localized laser heat input.→MEMSCareful process-development considerations for MEMS and compact microelectronic assemblies.→ConnectorsHow connector geometry and pin access influence laser solder ball jetting evaluation.→HDDA conservative process-evaluation view for HDD-related precision components.→OptoelectronicsLocalized laser soldering considerations for optoelectronic component assemblies.→MicroelectronicsLaser solder ball jetting evaluation for small microelectronic solder joints.→BGA / PackagingA careful feasibility approach to localized precision soldering in BGA and advanced electronic packaging contexts.→
From discussion to delivery
Bring the application into a clear equipment conversation
- Share the application. Send a close-up photo, drawing where available, target joint, current method and the result you need to assess.
- Review the process path. Discuss the part, fixture, reference, sample requirement and candidate configuration.
- Confirm the quotation scope. Define equipment, workholding, options, utilities and delivery scope around the project.
- Agree handover and support. Confirm the selected system’s documentation, commissioning, training and support requirements in the quotation.